Metaio reveals new Augmented Reality SDK to support latest 3-D camera and 3-D printing technologies
MUNICH & BARCELONA, 20 February 2014: Metaio, the world leader in augmented reality (AR) software and solutions, will showcase 3-D camera interfaces for augmented reality along with the latest in enterprise and wearable experiences at the 2014 Mobile World Congress (MWC) in Barcelona. Visitors to the Metaio booth in the App Planet, Hall 8.1, Booth 8.1G47, will get see how augmented reality is truly “creating what’s next” at the world’s largest mobile conference.
This year’s Mobile World Congress arrives at the dawn of the 3-D camera. Apple has acquired PrimeSense; NVIDIA has announced partnerships with SoftKinetic for embedded cameras; and Intel has announced the future embedding of RealSense 3-D cameras in Ultrabooks and other devices. Adding depth to interactive mobile experiences will provide all new capabilities in augmented reality, including 3-D reconstruction, dynamic occlusion and brand-new tracking for consumer and enterprise experiences.
“3-D cameras will soon arrive on mobile devices,” said Metaio CTO Peter Meier. “Developers and businesses alike will be able to take advantage of this new technology through the support for 3-D cameras in the Metaio SDK. This year in Barcelona we are showcasing how we have adapted our core technology to support this new wave of 3-D integration, while also demonstrating the power of silicon integration, especially with regard to a wearable future. AR has already shown usefulness and value in both enterprise and consumer sectors, and we will continue to lead the way in innovation for 2014.”
3-D integration opens up numerous possibilities for everyday use: consumers could visualize products in home without the need for markers or printouts; utilize gestures to interact with their devices and the real world; reconstruct or modify entire environments; or even create 3-D models on the fly that could be pushed to 3-D printing devices.
Metaio is already working with companies like SAP and Intel to bring the next generation of augmented reality to developers and users through mobile devices, wearable technology and embedded 3-D cameras.
“Intel has been collaborating this year with Metaio to showcase the power of combining Intel platforms with augmented reality, which can be seen at MWC 2014,” said Prasad Modali, Intel Principle Engineer. “We look forward to continuing these efforts to further blend the virtual and real worlds in the near future.”
Metaio collaborated with Intel to produce groundbreaking apps specifically for Intel mobile devices, which visitors will experience at the Intel booth, App Planet: Hall 8.1, booth #E41:
- “Portal Run”: a brand-new digital AR table-top game that utilizes instant SLAM tracking to allow players to play in any environment, anywhere. No board, marker (or even table) necessary.
Visitors to the Metaio booth at MWC will experience:
- The first hands-free augmented reality maintenance utilizing wearable computing- step-by-step instructions visualized through Epson Moverio BT-200 and Google Glass
- The new AREngine, the next generation of the first ever AR hardware IP, with 6000% faster initialization and 80% reduction in power consumption on silicon
- Next-generation AR experiences that utilize 3-D and depth cameras for real-time 3-D tracking and reconstruction
- The latest in enterprise and consumer demos, featuring experiences from IKEA, Audi, and Mitsubishi Electric
To try out the technology behind the booth demonstrations, sign up for a free Metaio account and download the Metaio SDK at http://my.metaio.com.
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